Cypress Semiconductor CY7C1360C Guide de l'utilisateur Page 4
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- Table des matières
- MARQUE LIVRES
Noté. / 5. Basé sur avis des utilisateurs
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Software Development Tools ...............................................................................................................36
Nios II Embedded Design Suite ..........................................................................................................36
Embedded Software Partners .............................................................................................................36
Hardware Development Tools .............................................................................................................36
Quartus II FPGA System Design Tool ................................................................................................37
SOPC Builder System-Level Integration Tool ...................................................................................37
SignalTap II Embedded Logic Analyzer .............................................................................................37
MegaCore IP Library ...........................................................................................................................37
Embedded Systems Board Solutions ......................................................................................................38
Board Solutions from Third Party Board Partners ...........................................................................42
ASIC PROTOTYPING ................................................................................................... 44
Why use FPGAs for ASIC prototyping? .................................................................................................44
Advantages of FPGA prototyping ...........................................................................................................44
Frequently Asked Questions ...................................................................................................................46
ASIC Prototyping Board Solutions.........................................................................................................48
Board Solutions from Third Party Board Partners ...........................................................................48
CONTACT INFORMATION ............................................................................................ 50
Japan ........................................................................................................................................................50
Hong Kong / China ..................................................................................................................................50
Taiwan / China.........................................................................................................................................50
ASEAN .....................................................................................................................................................50
- Application Solutions 1
- Guide Book 1
- About Macnica Group 5
- Macnica Group Facts 6
- Application Solutions Guide 7
- Book – November 2011 7
- Video System Solutions 8
- 1080p Video Design Framework 9
- Video Reference Designs 10
- IV GX Edition 13
- Daughter Cards 15
- Bitec Ltd 15
- High Speed External Memory 19
- Interface Solutions 19
- DRAM Device Overview 20
- SRAM Device Overview 21
- ZBT SRAM Devices 22
- Accverinos Co.,Ltd 24
- Transceiver Portfolio 25
- Protocol Solutions 26
- Transceiver Signal Integrity 29
- Development Tools 35
- Software Development Tools 36
- Embedded Software Partners 36
- Hardware Development Tools 36
- MegaCore IP Library 37
- MAX II Development Kit 39
- MAX V Starter Kit 39
- Cyclone III USB3.0 Board 40
- Cyclone III Base 40
- Board (Aquamarine) 40
- Galaxy NIOS Starter Kit 41
- Galaxy MAX II Starter Kit 42
- ASIC Prototyping 44
- Parallel verification 45
- Frequently Asked Questions 46
- EK4SEH40 48
- S2C Inc 49
- Terasic Technologies 49
- Contact Information 50
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