February 25, 2005 Document No. 38-12022 Rev. *G 31
CY8C21x23 Final Data Sheet 4. Packaging Information
Figure 4-4. 24-Lead (4x4) MLF
4.2 Thermal Impedances
4.3 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 4-1. Thermal Impedances per Package
Package Typical θ
JA
*
8 SOIC
186
o
C/W
16 SOIC
125
o
C/W
20 SSOP
117
o
C/W
24 MLF
40
o
C/W
* T
J
= T
A
+ POWER x θ
JA
Table 4-2. Solder Reflow Peak Temperature
Package Minimum Peak Temperature* Maximum Peak Temperature
8 SOIC
240
o
C 260
o
C
16 SOIC
240
o
C 260
o
C
20 SSOP
240
o
C 260
o
C
24 MLF
240
o
C 260
o
C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5
o
C
with Sn-Pb or 245+/-5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
51-85203 **
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