Cypress Semiconductor enCoRe CY7C601xx Guide de l'utilisateur télécharger pdf (Page 58)

CY7C601xx

CY7C602xx

Document 38-16016 Rev. *C Page 58 of 62

Ordering Information

Ordering Code FLASH Size RAM Size Package Type

CY7C60123-PVXC 8K 256 48-SSOP

CY7C60123-PXC 8K 256 40-PDIP

CY7C60113-PVXC 8K 256 28-SSOP

CY7C60223-PXC 8K 256 24-PDIP

CY7C60223-SXC 8K 256 24-SOIC

CY7C60223-QXC 8K 256 24-QSOP

Package Diagrams

Figure 24. 24-Lead (300-Mil) SOIC S13

PIN 1 ID

SEATING PLANE

0.597[15.163]

0.615[15.621]

112

13 24

0.291[7.391]

0.300[7.620]

0.394[10.007]

0.419[10.642]

0.050[1.270]

TYP.

0.092[2.336]

0.105[2.667]

0.004[0.101]

0.0118[0.299]

0.0091[0.231]

0.0125[0.317]

0.015[0.381]

0.050[1.270]

0.013[0.330]

0.019[0.482]

0.026[0.660]

0.032[0.812]

0.004[0.101]

PART #

S24.3 STANDARD PKG.

SZ24.3 LEAD FREE PKG.

MIN.

MAX.

NOTE :

1. JEDEC STD REF MO-119

2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT

MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE

3. DIMENSIONS IN INCHES

4. PACKAGE WEIGHT 0.65gms

DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.

51-85025 *C

1 2 ... 53 54 55 56 57 58 59 60 61 62

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